Dynatex International

What's new from Dynatex International? Stay tuned next week to be the first to find out!

WaferGrip Adhesives are designed to bond wafers, thin film heads, optics, and other substrates during dicing, grinding, lapping, and polishing. Designed to minimize air voids and minimize thickness variation, WaferGrip is a more accurate, consistent alternative to wax adhesives.

Learn how WaferGrip can improve your bonding process:
http://www.dynatex.com/wafergrip-adhesives_8_113_26194.html

Wafer expansion is a critical step to avoid die edge chipping during the pick and place process and shipping. Our DXE wafer expanders provide the next step in the wafer dicing process, expanding the space between diced semiconductor die through omni-directional stretching of the tape on which these die are mounted, while also providing heat to increase the elasticity of the tape.

Learn how our solutions can optimize your wafer expansion process:

http://www.dynatex.com/wafer-expanders_8_115.html

The DXB 880 wafer bonder adds automated process control to the DXB series' list of benefits.

The user is able to program each process step with extreme precision, ensuring a repeatable and consistent process. Active cooling and dual chamber operation ensure speed and accuracy.

Introducing Dynatex International's new GSX Scribe and Break!

The GSX is the latest in Dynatex International's line of advanced wafer dicing equipment. Available as a Scribe and Break or Break Only system, the GSX is built upon existing GST systems and introduces many features previously exclusive to our DTX series.

Learn more at:
http://www.dynatex.com/gsx-refurbished-gst_8_108_26191.html

Dynatex International is excited to announce the launch of our new company website! Created with our customers in mind, our new website features easier navigation, in-depth product information, and a range of downloads and technical data for all of our product lines. Visit our new website at: www.dynatex.com