Dynatex International

Dynatex International has been the leader in dry process/wafer dicing since 1958.

With over five decades of experience, Dynatex offers a strong base of technical accomplishments and business expertise to assist you with your specific product requirements. Dynatex provides a complete line of die singulation products for dry process dicing, wafer bonding and saw dicing systems. These products are productivity enhancement tools for dicing silicon, gallium arsenide, thin film heads, flat panel displays, solid state lasers and other materials or products.