CREST R&D Talent Development

🚀 Ready to be at the forefront of next-gen power electronics?

Join us for the Infineon WBG Technology Academy, a 3-day immersive experience jointly organized by Infineon, USM, and CREST! From powering AI data centers to enabling efficient green energy grids, Wide Bandgap (WBG) technology is defining the future of engineering.

Here is what you can expect across three days of immersive WBG experience:

⚡ Day 1: High-Voltage Device Physics – Dive into the science behind WBG technologies with expert talks on SiC for green energy, GaN power devices, poster presentations, and a laboratory tour.

🔬 Day 2: Material Science of WBG Wafer Technologies – Explore advanced materials with sessions on SiC MOSFET process technology, growth of nanostructured GaN, and wide-bandgap random lasers.

🤝 Day 3: Shaping Future Semiconductor Talent – Build connections and align university curriculums with industry needs through forums and a roundtable on the Malaysia Semiconductor Innovation Network.

Who should attend?
Tertiary education students and academicians from public and private universities in Malaysia, alongside engineers, researchers, and technical professionals passionate about semiconductor innovation.

🎟️ Admission: FREE!
📅 Dates: 13–15 October 2026
📍 Venue: USM, Pulau Pinang
⏰ Registration Deadline: 9 October 2026, 5:00 PM

Let's work together for a stronger semiconductor ecosystem and empower Malaysia's next-gen talent!

More information here: https://crest.my/wbgtechnologyacademy/

👉 How to join: Scan the QR code in the attached poster or click the link below to secure your spot before the deadline!

🔗 https://shorturl.at/QcE0j

🎓 Be Part of a PhD Journey at Universiti Sains Malaysia (USM)! 🌟

Are you passionate about greener materials and a brighter future? We are looking for a dedicated PhD candidate to contribute to innovative research for a sustainable tomorrow!

🔬 Research Title: Bio-Derived Substrates for High & Low Temperature Sustainable Electronic Packaging Application: Design, Fabrication & Reliability Assessment.
🤝 Sponsored by: SanDisk.

What You Will Gain:
- Work on a cutting-edge, industry-relevant research project focusing on bio-based materials and sustainable electronics.
- Receive a monthly stipend and have your fees paid by the grant. - Get guidance and mentorship from experienced supervisors, including Industrial Supervisor Dr. Mutharasu Devarajan from SanDisk.
- Gain exposure to advanced research facilities and professional development.
- Benefit from the potential for research publications and conference participation.

Requirements:
- A background in Materials Engineering, Polymer Engineering, Chemical Engineering, Chemistry, or a related field.
- Highly motivated, hardworking, independent, and proactive.
- Strong interest in sustainable materials, electronic packaging, and related research.
- Good analytical and problem-solving skills, with a willingness to learn, take initiative, and work in a team.
- Industry experience with at least 2+ years is preferred.

📩 Interested?
Please send your CV to:
> Prof. Ir. Dr. Mariatti Jaafar (USM) at [email protected]
> Dr. Mutharasu Devarajan (SanDisk) at [email protected]

Join us in developing innovative materials for a sustainable electronic future! 🌱💻

Greetings from CREST!

We are pleased to share our upcoming training schedule for September till November 2026 under the Engineering Talent for Semiconductor Industry (ETSI) Programme. These programmes are thoughtfully designed to address the evolving needs of the semiconductor industry and support the continuous development of workforce capabilities.

All listed courses are HRD Corp Claimable, enabling organisations to optimise their training and development budgets while investing in the growth of their semiconductor talent.

Advanced Packaging (Physical)
1) Introduction to Advanced Packaging Techniques: 2.5D, 3D, Chiplets and Integration Technologies - 29th & 30 September

2) CoWoS Technology for AI Systems and HPC Packaging Integration - 5th October

3) Advanced Packaging Thermal Management for 2.5D and HPC Applications - 8th October

4) Advanced Packaging Reliability and Failure Mode - 13th October

5) Next-Generation Advanced Packaging Technologies (5 Days) - 9th - 13th November

Advanced Packaging (Online)
1) Introduction to Advanced Packaging Techniques: 2.5D, 3D, Chiplets and Integration Technologies - 22nd & 23rd September

2) CoWoS Technology for AI Systems and HPC Packaging Integration - 24th September

Exclusive Discounts for CREST Members
- SME Members: 10% Discount
- Non-SME Members: 8% Discount

Discounts for Non- CREST Members
- Early Bird: 5% Discount (registration 2 weeks before commencement of training)

- Group Registration (more than 3 participants): 5% Discount

Whether you are looking to enhance technical expertise, strengthen leadership skills, or stay abreast of the latest industry advancements, these training programmes offer valuable learning opportunities for professionals at all levels.

👉 Register Now – Contact us for more details

For detailed course information, training brochures, and the full programme schedule, please visit the CREST ETSI Training Portal.
For enquiries, please contact [email protected].

Build Skills. Strengthen Talent. Power the Future of Semiconductors.

We look forward to welcoming you and your team to our upcoming programmes.

Greetings from CREST!

As the semiconductor industry continues to advance, developing relevant technical capabilities is essential to building a competitive and future-ready workforce. Our training programmes are designed to equip professionals with focused, industry-relevant knowledge and practical skills across semiconductor design, digital systems, artificial intelligence, robotics, and autonomous technologies.

We are pleased to invite you to explore the upcoming CREST-UTM Semiconductor Trainings, taking place from September to November 2026 under the Engineering Talent for Semiconductor Industry (ETSI) Programme.

Upcoming Training Programmes
📍 Venue: Penang

VLSI & Digital IC Design
1) VLSI Circuits and Design Part 3: Optimization of CMOS Digital Logic Circuits — 21 & 22 September

2) Digital Circuit Modeling Using Hardware Description Language — 5 & 6 October

3) Register-Transfer Level Modeling of Sequential Circuits — 7 & 8 October

4) Digital Circuit Modeling Using Hardware Description Language — 12 & 13 October

5) Register-Transfer Level Modeling of Sequential Circuits — 14 & 15 October

6) Register-Transfer Level Modeling of Complex Sequential Circuits — 19 & 20 October

AI, Robotics & Autonomous Systems
1) Locomotion and Motion Planning: Kinematics and Dynamics of Mobile Robots — 19 & 20 September

2) Object Detection and Recognition — 5 & 6 October

3) AI-based Image Enhancement Using Segmentation — 17 & 18 October

4) Perception and Mapping: Sensor Fusion for Autonomous Navigation — 31 October & 1 November

Exclusive Discounts for CREST Members
- SME Members: 10% discount
- Non-SME Members: 8% discount

Discounts for Non- CREST Members
- Early Bird: 5% Discount (registration 2 weeks before commencement of training)
- Group Registration (more than 3 participants): 5% Discount

👉 Register Now – Contact us for more details

For detailed course information, training brochures, and the full programme schedule, please visit the CREST ETSI Training Portal.
For enquiries, please contact [email protected].

Build Skills. Strengthen Talent. Power the Future of Semiconductors.
We look forward to welcoming you and your team to our upcoming programmes.

FREE ADVANCED PACKAGING TRAINING

In conjunction with HRD Corp National Training Week (20th till 26th July 2026), CREST ETSI Master Trainers will be conducting approximately 38 Advanced Packaging topics for FREE (Online and E-Learning/Self-Paced). Feel free to register via the NTW website and sign up for our courses.

The full course list and registration links are available at:
https://crest.my/etsi_ntw/

Don’t miss out!

To learn more about Engineering Talent for Semiconductor Industry (ETSI), visit us at https://lnkd.in/gHCyJ7S5