PDF Solutions

We're heading to EE Times: The Road to Chiplet Scalability — and Greg Prewitt is leading the way.

Greg, Product Manager of Exensio® Test Operations at PDF Solutions, presents next week ok June 23 at 12:15 PM PDT. His session introduces our Data Feed Forward (DFF) infrastructure — a production-proven approach to collecting, transforming, and applying test data across chiplet supply chains.

The goal: smarter test coverage, real-time model enrichment, and yield gains that scale with your architecture.

Register and join Greg's session here: https://chiplets.eetimes.com/?utm_source=PDFSolutions&utm_medium=social&utm_campaign=chiplets26

Here's a perspective worth sitting with: agentic AI in semiconductor manufacturing isn't a revolution. It's the next chapter in a 40-year story.

At the APCM 2026 conference, Jon Holt, VP of Product Management at PDF Solutions, walked through exactly how we got here — from early CIM systems in the 1980s to today's multi-agent coordination frameworks. The infrastructure that makes agentic AI practical wasn't built overnight.

The real bottleneck today isn't the AI itself. It's integration, standardization, and having the data platform to support it all.

We've been building that platform for decades. That's our point of view — and it's the one Jonathan laid out on stage.

Full SemiWiki article here: https://bit.ly/3PPu0S5

At 7nm, the way transistors are arranged on a chip can actually hurt performance — even when the process is working exactly as designed.

Our new podcast episode breaks down why. Nearby isolation structures like diffusion breaks and gate cuts can relax engineered strain in FinFET transistors, leading to up to 10% performance loss in PMOS devices. That finding comes from analysis of more than 30,000 test devices.

The path forward is predictive: building models that let designers anticipate these effects before tape-out, not after.

Episode 2 is live now. Give it a listen.
🎙️https://go.pdf.com/l/814523/2026-06-08/cxy48

PDF Solutions is heading to EE Times: The Road to Chiplet Scalability — and we're bringing expertise.

Greg Prewitt, our Product Manager of Exensio® Test Operations, will present on June 23 at 12:15 PM PDT. He'll cover how our Data Feed Forward infrastructure uses AI to move test data intelligently across chiplet supply chains — improving yield and cutting waste at every stage.

We're also a proud sponsor of this virtual event. Register now at https://bit.ly/4dYLPaU — it's free to attend.

We're thrilled to welcome Ramune Nagisetty to PDF Solutions as our new Director of Enterprise Accounts.

Ramune brings 29 years of Intel experience — from device physics research to leading strategic programs at the CEO and CTO level. It's a rare combination of deep technical expertise and enterprise-level perspective.

What brought her to us? Read her story and find out: https://go.pdf.com/l/814523/2026-06-05/cxwsg

Advanced test is quickly becoming one of the semiconductor industry’s most promising frontiers—powering innovations like adaptive binning, feed-forward models, and real-time analytics. But there’s a critical challenge holding progress back… and it’s not algorithms or compute—it’s data.

As highlighted in this recent Semiconductor Engineering article by Greg Prewitt, “What’s Really Needed for Advanced Test?”, the real issue lies in the fundamentals:

“Advanced test has become one of the semiconductor industry’s most promising frontiers. But there is a problem hiding underneath all that ambition… it is data. More specifically, the question of whether the data flowing across the fab-to-test chain is clean, complete, and correctly associated in the first place.”

At PDF Solutions, we see leading manufacturers treating data quality as a first-class KPI and they actively measure data health, standardization, and completeness to ensure their advanced test strategies deliver real value.

📖 Read the full article: https://semiengineering.com/whats-really-needed-for-advanced-test/

🚀 Join Us at PDF Connect 2026! 🚀

We’re excited to announce PDF Connect 2026, our premier event bringing together leaders, innovators, and experts across the semiconductor ecosystem.

📅 October 15–16, 2026
📍 The Westin St. Francis | Union Square, San Francisco, CA

At PDF Connect, you’ll gain exclusive insights into the latest advancements in data analytics, AI-driven solutions, and operational intelligence—designed to help you accelerate yield, optimize performance, and unlock greater value across your operations.

💡 What to expect:

✔️ Thought-provoking keynote sessions
✔️ Deep-dive technical discussions
✔️ Networking with industry peers and experts
✔️ Real-world success stories from customers and partner

Don’t miss this opportunity to connect, collaborate, and explore what’s next.
👉 Learn more and register today: https://events.pdf.com/connect2026/

We’re excited to introduce our new podcast series, “FinFET Local Layout Effects,” where we unpack what’s really driving semiconductor innovation in the post-scaling world—at the level of physics itself.

🎙️ Episode 1: How Transistor Neighborhoods Alter Device Physics

In this episode, we explore a fundamental shift in chip design: Layout is no longer just a blueprint—it changes how transistors behave.

As devices moved into 3D FinFET architectures, engineers gained control over electrostatics—but introduced a new challenge: mechanical stress at the nanoscale.

🔍 If you’re working in advanced nodes, device modeling, or chip architecture, this is a conversation you don’t want to miss.

🎧 Listen to Episode 1: https://go.pdf.com/l/814523/2026-06-02/cxmgq

What is silicon really telling us?

This blog dives into the physics behind stress-related Local Layout Effects (LLEs)—and why features like diffusion breaks and gate cuts are quietly shaping device performance, leakage, and variability in ways traditional design assumptions can’t ignore.

What looks like randomness in silicon is actually predictable physics.

The key insight?

What may look like randomness in silicon is actually predictable, modelable behavior—when you understand the underlying physics.

That’s where advanced modeling and silicon-correlated analytics come in—turning complexity into actionable design and process insights.

👉 Read the full blog: https://go.pdf.com/l/814523/2026-05-26/cxbg1

Is Agentic AI really a revolution in semiconductors… or the next step in a long evolution?

While it’s often framed as a breakthrough, today’s agentic AI builds on 30–40 years of progress in process control, data infrastructure, and system integration.

At PDF Solutions, we see this as momentum, not disruption. The real opportunity is leveraging decades of data and expertise to scale smarter, faster decisions.

The future isn’t about replacing legacy systems.
It’s about activating the intelligence already embedded within them.

👉 Read the full article "From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its Past" https://bit.ly/4d5xdmO