Phoenix Components LLC: www.phoenixcomponentsllc.com

Who are we:

Phoenix Components: a Manufactures Representative

What are we:

A manufacturing sales representative organization selling goods for manufacturers (principals) to OEM’s and contract manufactures over several industries. We develop potential customers, and bring together the experts in their field to explain their capabilities.

Requirements:

Must be versed in Excel, PowerPoint, Word, and Office 365 with good communication skills.

Responsibilities include general office needs such as phone work, emails, daily mail / bank deposits.

Track Sales Commissions by territory and continue follow up on activity by principals.

Maintain Sample log. Enter Invoice’s into Workbook (Excel) -Keep Updated Principal Monthly Reports as required.

Print Line Cards as Needed. Schedule Conference calls using Uber.com when needed.

Send a prospective Principal our Company Prospectus and Vendor Questionnaire (Excel) whenever requested and keep Prospectus up to date (PowerPoint).

Maintain Website / Linkedin / Facebook and all social media.

Order all office supplies as needed and maintain company calendar. Renew yearly company licenses.

Basically, you are the liaison between the Principals and our customers.

Job starts January 2, 2019

Working Hours 8:30 am -12:00pm /Lunch 12:00 – 1:00/ 1:00pm -5pm Monday through Friday

New hires have a 90-day probation period for permanent employment and eligibility for health insurance for the employee only.

Salary monthly/ paid monthly.

Vacation / Sick Leave

First year 10 days combined Second – Five years 15 days combined

Email Resume & Salary Requirements to:
Rick Tally - [email protected]

Phoenix Components is pleased to announce that we have agreed to represent Flexxon https://www.flexxon.com/ in Florida

Flexxon is industrial NAND flash storage & memory manufacturer, we focus only on Industrial, Medical & Automotive (IMA) products

Industrial NAND Storage Solution Provider Flexxon is the top designer, manufacturer as well as markets the highly advanced Nand flash memory Solution products with serving the Industrial, Medical and Automotive (IMA) applications.

We've got what you need!! Phoenix Components LLC!

Join Phoenix Components LLC and PFC Flexible Circuits at AmCon Orlando, May 22-23, 2018! See you there!

NEW from SunLED! 0805 Dome Lens SMD Lens! Check it out! Featured on Digi-Key! Call us for more information. Phoenix Components LLC: 321-723-4414/ [email protected] / www.phoenixcomponentsllc.com

Amazing Technology!

Meet the most nimble-fingered robot ever built [VIDEO] - Today's Medical Developments This technology could soon be applied in industry, with the potential to revolutionize manufacturing and the supply chain.

~ PFC Flexible Circuits ~
When Reliability and Precision are Critical. Used on the MARS ROVER.

PFC FLEXIBLE CIRCUITS - When Reliability and Precision are Critical!

Let Phoenix Components Help You From Concept to Complete Product Fulfillment! Founded here in Florida in 1982, Phoenix Components continues to provide outstanding service to both our Principals and customers, believing integrity and quality go hand-in-hand.  Whether you need

Don't Forget!
Space Coast Expo & Tech Forum
Your local electronics assembly and manufacturing trade show!
Tomorrow!
November 17th, 2016
Melbourne Auditorium
625 E. Hibiscus Blvd.
Melbourne, FL

Join us at the Melbourne Auditorium for:
3 COMPELLING TECHNICAL PRESENTATIONS,
75+ Exhibitors and COMPLIMENTARY lunch!

Click HERE for more information
Exhibit Hours: 10:00am - 4:00pm


Program Schedule
0AM:
Registration Opens

9:00AM-10:00AM
Voiding Under Bottom Terminated Components
Speaker: Pat Ryan, Indium Corporation
One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs. This solder voiding, especially on thermal pads, can lead to hot spots and a reduction in the life of the component and the overall assembly. Without careful design considerations, it is also difficult to obtain precision in the level of voiding from one component to another. This paper looks at the cause and effect of voiding and a new approaches using solder paste chemistries and readily available solder preforms. It has been determined that this approach can both decrease the level of voiding found in the solder joints beneath bottom terminated components and also decrease the amount of variation. While this paper focuses on this technique when used with SAC305, it is versatile enough to be used with other alloys commonly available in paste and solder fortification preform forms today. This method also has the added benefit of being fully compatible with current manufacturing processes, adding only extra placement steps without the need to change reflow profile, equipment, etc. This easy and inexpensive modification to current processes can have a big impact on the reliability of the final product.

10:00AM
EXPO OPENS

11:00AM-12:00PM
Optimization of the Reflow Profile to minimize Voiding
Speaker: MB Allen, KIC
Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal, and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.

12:00PM - 1:00PM:
Complimentary Lunch

1:00PM
Soldering Challenge Begins

1:30PM - 2:30PM:
Advances in Stencil Technology for Achieving Successful Printing Results
Chrys Shea, Shea Engineering Services
Fresh from the SMTA International Conference, Chrys is bringing the latest research and development in stencil printing to address important questions from the users' perspective:

* How does nanocoating help the print process? Is it worth the cost?
* Will high tension stencils improve print quality?
* When should Type 5 solder paste be considered for fine feature printing?
* What's the difference between wet wiping and dry wiping?
* Do wiper parameters, papers, solvents and sequences make a big difference?
* What are the new methods of making stepped stencils?
* What is the role of wall roughness in the print process?
Come to this presentation to:
* REVIEW the data
* SEE the photos
* WATCH the videos
* LISTEN for tips and tricks that will help your process
If you couldn't get to the SMTA International conference, the latest published research is coming to you! Highlights of technical studies published by AIM, KYZEN, Shea Engineering Services, MET, FCT, and a 4-company New England consortium will be included in the presentation.

2:45PM:
Drawing For Raffle Prizes

4:00PM:
Expo Closes


Don't Forget!
Space Coast Expo & Tech Forum
Your local electronics assembly and manufacturing trade show!
Tomorrow!
November 17th, 2016
Melbourne Auditorium
625 E. Hibiscus Blvd.
Melbourne, FL

Join us at the Melbourne Auditorium for:
3 COMPELLING TECHNICAL PRESENTATIONS,
75+ Exhibitors and COMPLIMENTARY lunch!

Click HERE for more information
Exhibit Hours: 10:00am - 4:00pm

Program Schedule



8:00AM:
Registration Opens

9:00AM-10:00AM
Voiding Under Bottom Terminated Components
Speaker: Pat Ryan, Indium Corporation
One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs. This solder voiding, especially on thermal pads, can lead to hot spots and a reduction in the life of the component and the overall assembly. Without careful design considerations, it is also difficult to obtain precision in the level of voiding from one component to another. This paper looks at the cause and effect of voiding and a new approaches using solder paste chemistries and readily available solder preforms. It has been determined that this approach can both decrease the level of voiding found in the solder joints beneath bottom terminated components and also decrease the amount of variation. While this paper focuses on this technique when used with SAC305, it is versatile enough to be used with other alloys commonly available in paste and solder fortification preform forms today. This method also has the added benefit of being fully compatible with current manufacturing processes, adding only extra placement steps without the need to change reflow profile, equipment, etc. This easy and inexpensive modification to current processes can have a big impact on the reliability of the final product.

10:00AM
EXPO OPENS

11:00AM-12:00PM
Optimization of the Reflow Profile to minimize Voiding
Speaker: MB Allen, KIC
Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal, and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.

12:00PM - 1:00PM:
Complimentary Lunch

1:00PM
Soldering Challenge Begins

1:30PM - 2:30PM:
Advances in Stencil Technology for Achieving Successful Printing Results
Chrys Shea, Shea Engineering Services
Fresh from the SMTA International Conference, Chrys is bringing the latest research and development in stencil printing to address important questions from the users' perspective:

* How does nanocoating help the print process? Is it worth the cost?
* Will high tension stencils improve print quality?
* When should Type 5 solder paste be considered for fine feature printing?
* What's the difference between wet wiping and dry wiping?
* Do wiper parameters, papers, solvents and sequences make a big difference?
* What are the new methods of making stepped stencils?
* What is the role of wall roughness in the print process?
Come to this presentation to:
* REVIEW the data
* SEE the photos
* WATCH the videos
* LISTEN for tips and tricks that will help your process
If you couldn't get to the SMTA International conference, the latest published research is coming to you! Highlights of technical studies published by AIM, KYZEN, Shea Engineering Services, MET, FCT, and a 4-company New England consortium will be included in the presentation.

2:45PM:
Drawing For Raffle Prizes

4:00PM:
Expo Closes

Current Exhibitors
Companies in bold are SMTA Corporate Members

Current Exhibitor List:
Acculogic Inc.
Aegis Industrial Software
AGI Corporation
AI Technology, Inc.
AIM
Alpha Assembly Solutions
Amitron Corporation
AOI SYSTEMS
APE.com
Apex Factory Automation
Ascentec Engineering
ASM Assembly Systems, LLC
Aven Inc.
Baja Bid LLC
BTU International/Nordson ASYMTEK
Circuits LLC
Conductive Containers, Inc.
Conecsus LLC
ECD
ELANTAS PDG, Inc.
Electro-Comp Tape & Reel Services, LLC
Electrotek Corporation
EMC3 Group
EPTAC Corporation
Europlacer Americas
Finetech/Martin
Floritronics, LLC
GPD Global
Harris
Henkel
HISCO, Inc.
IMAPS
IMDS DATA
Indium Corporation
Island SMT
JBC Tools USA Inc.
JENSEN Tools + Supply
Kurt Whitlock Associates
Kurt Whitlock Associates/ERSA/Komax
KYZEN Corporation
Lindstrom Precision Tools
Lone Star Circuits
MET Stencil
Metcal
MicroCare Corporation
Micross Components
Mid-America Taping & Reeling, Inc.
NCAB Group USA
Nikon Metrology, Inc.
Omron Inspection Systems
PACE Inc.
Panasonic Factory Solutions Company of America
PFC Flexible Circuits Ltd.
Photo Etch Technology
PVA
Rehm Thermal Systems, LLC
Robert McKeown Company Inc
Saki America
Scienscope International
SEHO North America
Seica Inc.
SemiPack Services, Inc.
Simco-Ion
Smart Splice LLC
Sovella Inc
Technical Resources Corporation
Techspray
TEK Products
Tharium
Tintronics
Trans-Tec/YAMAHA
Tropical Stencil, Inc.
Universal Instruments
Viscom Inc.
Vitronics Soltec/ KIC
Weller
ZESTRON Americas



Any Questions?

Please contact
Kaitlyn Gherity
SMTA Expo Manager
952-920-7682