Gel-Pak

Visit us at MD&M West from February 7-9 in Anaheim, CA.💡Whether you’re a large Fortune 500 company or a small startup manufacturer, we’ve got solutions for your devices, including biocompatible elastomer-coated boxes, slides, trays and films as well as custom extrusion and coating of PDMS, TPU and other specialty films. Visit us at booth #2566 to learn more!

It’s not too late to register for MD&M West! We'll be onsite to demonstrate our custom Silicone, TPU, and TPE film extrusion and coating capabilities, along with our biocompatible carriers for the medical device industry. We have a strong track record of investigating and developing new materials, solutions and form factors for our customers’ high-value devices - stop by to talk to us about your latest project. https://imewest23.mapyourshow.com/8_0/exhibitor/exhibitor-details.cfm?exhid=20060

We’ll be at the IMAPS 8th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics. Curious about how to keep your high-value medical microelectronics safe during transport and handling? Our R&D Director Victoria Tran will present on how biocompatible carriers and packaging help mitigate damage during handling and transport. Don’t miss her session on February 2nd at 3:15 pm .https://www.imaps.org/medical_microelectronics_2023.php

The 2023 IPC APEX EXPO is just around the corner! If you’d like to speak with us during the show, reach out to Jennifer Nunes at [email protected]. We’d love to talk about how we can work with you to develop custom and innovative solutions for device handling and transport.

With the 2023 Chiplet Summit a little under one week away, what are you looking forward to seeing at the show? Make sure that our R&D Director Dr. Victoria Tran's presentation on micro-textured film for handling 3D devices is on your list! She’s presenting on January 25 at 3:15 PM. Or contact us to set up a meeting at the show! [email protected]

The global semiconductor industry has a complex supply chain process that requires IP, equipment, packaging, and other components, oftentimes sourced from multiple regions for a single resulting product. Semiconductor Engineering recently looked at the challenges. Click here to learn more:

Strengthening The Global Semi Supply Chain Robust partnerships and multi-party innovation will be essential to manage complexity and cost.

An interesting look at the process of making chips, published by Wall Street Journal. With such a rigorous process combined with the chip shortage, reducing factors that can contribute to yield loss such as improper device transportation is more crucial than ever. Check out the full article here:

There Aren’t Enough Chips — Why Are They So Hard to Make? An upstate New York factory shows the complicated process of turning silicon into a chip.

Could extend Moore’s law? EE Times recently published an insightful article on the advantages of chiplets to improve yield on each wafer and reduce production costs, and we’re exploring opportunities to support this emerging market. Read the article: a.

Moving from SoCs to Chiplets could help extend Moore’s Law - EE Times As Moore’s Law is again reaching its limits, several technologies, specifically Chiplets, could be the key to extending it for many more years. Moore’s

Chiplets are quickly gaining an incredible amount of traction. According to Verdict, “Module building blocks have moved semiconductor innovation from system-on-chip (SoC) to system-on-package (SoP) chip architectures because the feasibility of implementing complex systems on monolithic dies had reached its physical and economic limits.” We anticipate the accompanying requirements for safe handling and transport will be more essential than ever to protect yields and prevent excess costs. Read more on the rise of here:

Chiplets with everything at the semiconductor cafe Chiplets are on the menu! A ‘chiplet’ is one part of a processing module that makes up a larger integrated circuit like a computer processor.

According to Semi Engineering, design approaches have helped create electrical, functional, and physical building block landscapes whereby IC functional blocks can be qualified and reused over and over. Benefits include improved silicon architecture flexibility, reuse, reduced time-to-market, and lower overall cost. Read more here:

Heterogeneous IC Packaging: Optimizing Performance And Cost Choice of packaging technology is influenced by the communication interface between chiplets.

Be sure to visit us at IMAPS International from October 3-6 in Boston! We will be onsite in booth 209 and hosting two poster sessions. CTO Raj Varma will discuss how our micro-textured film supports universal handling of 3D devices, while BAE Systems’ Craig Blanchette will showcase our collaborative LCS2 Lid/Clip System that prevents thin semiconductor die from migrating during shipping and handling. www.gelpak.com/lcs2 and https://www.gelpak.com/texturized-film-device-carrier-products/

BIOMEDevice is 2 weeks away, will we see you in Boston? During the show, we will present on biocompatible packaging for delicate medical components. To book a meeting with us at the show, please DM Jennifer Nunes, or, to learn more and register click here: https://www.biomedboston.com/en/home.html