Resin Formulators

RF 713 A/B is a conductive epoxy adhesive system designed for applications where traditional hot-solder processes are impractical. ⚡

RF 713 A/B delivers:
✅ High electrical conductivity
✅ Thixotropic flow for controlled dispensing
✅ Strong physical bond strength
✅ Effective EMI shielding performance

Built for conductive bonding, grounding, and shielding applications in advanced electronics assemblies.

👉 Shop RF 713 A/B: https://hubs.li/Q04kC7BV0

What makes an electronics potting compound reliable?

Material behavior plays a critical role in encapsulation performance — from thermal conductivity and viscosity to cure behavior and thermal stability.

At Resin Formulators, our in-house polymer characterization testing services help evaluate material properties that influence processing consistency and long-term application performance through advanced testing methods including:
✅ Differential Scanning Calorimetry (DSC)
✅ Coefficient of Thermal Expansion (CTE) Analysis
✅ Tg Testing
✅ Viscosity Characterization
✅ Cure Behavior Analysis

👉 Learn more about our polymer characterization testing services: https://hubs.li/Q04k7cz30

Let’s Bond Over Innovation 🔬

From aerospace to advanced manufacturing, Resin Formulators delivers world-class, custom epoxy systems engineered to solve your toughest challenges. Whether you need to meet strict regulatory standards or enhance performance, our expert chemist, Julieta Zataray is here to help.

Julieta helps solve your toughest epoxy formulation challenges by leveraging her expertise in organic chemistry, chemical engineering, and advanced elastomer solutions from Hutchinson Seal.

Request a free consultation: https://hubs.li/Q04jfhFS0

RF 1164 A/B is a low-density syntactic epoxy system developed for satellite panel edge filling.

In this case study, a satellite OEM needed to balance two competing requirements: low viscosity for efficient processing and high-temperature stability for in-service performance. Their existing approved materials could not deliver both.

RF 1164 A/B was formulated to meet both — providing:
✅ Consistent flow for edge filling and process control
✅ High-temperature stability for aerospace environments
✅ A single qualified material to simplify production

The result: improved manufacturing efficiency without compromising performance.

If you're evaluating materials for aerospace or high-performance applications, our team can help.

👉 Learn more and request a consultation: https://hubs.li/Q04ghvrr0

Day One of SAMPE 2026 is underway!

Stop by Booth M25 to meet the Resin Formulators team, and learn how our custom epoxy systems are supporting next-generation composites applications across aerospace, defense, electric vehicle, and advanced air mobility.

From high-strength bonding and lightweight core fills to precision infusion resins, we deliver both ready-to-use and custom solutions tailored to your performance requirements — backed by AS9100D & ISO 9001:2015 certification and a global distribution network.

The countdown to SAMPE 2026 is on!

Visit Resin Formulators at booth M25 to explore our custom formulations and ready-to-ship epoxy systems. Our materials are engineered for mission-critical structural and thermal performance across aerospace, defense, EV, and advanced air mobility.

👉 Enjoy a free exhibit pass valued at $50 using our special code M25: https://hubs.li/Q04dctF-0

We can’t wait to see you there!

Can your epoxy systems stop thermal runaway — or just withstand it? 🔥

Flame-retardant epoxies are engineered to contain thermal events before they spread.

Thermal runaway is a self-accelerating reaction that can rapidly escalate if materials aren't engineered to respond. Specialty resins meeting UL 94 V-0 and FAR 25.853 can trigger char formation under extreme heat, creating a sacrificial barrier that blocks oxygen and preserves dielectric strength.

Understanding these mechanisms is critical to protecting aerospace and EV components when it matters most.

👉 Explore how high-temperature epoxy systems mitigate thermal runaway in our latest article: https://hubs.li/Q04cYR-G0