Sandvik Additive Manufacturing

We’re looking forward to exhibiting at SEMICON Taiwan next week!

If you’re attending the event, visit us at booth X0016 and meet our experts in Osprey® CE alloys, Joseph Gauspohl and Shazi Sheikh.

We’ll be there to talk about the material challenges in semiconductor equipment, from thermal stability and dimensional control to weight and performance requirements.

Have a specific challenge in mind? Stop by booth X0016 for a chat.

See you in Taipei!

In a world of new alloy developments and increasingly specialized materials, it’s easy to overlook the workhorses.

Take 18Ni300.
Strength, toughness, dimensional stability, weldability, machinability before hardening, and a highly predictable age-hardening response. Few alloys perform well in all categories simultaneously. That’s why 18Ni300 remains one of the most widely used materials in metal AM.

Sometimes, the best material for the job isn’t the newest one. It’s the one that’s proven itself time and time again.

Download the Osprey® 18Ni300 datasheet: https://go.sandvik/2db

Titanium is known for its exceptional strength-to-weight ratio, but achieving the desired mechanical properties depends on more than adding the right alloying elements.

Tight control of oxygen and other interstitial elements is equally important. Even small increases can reduce ductility and fracture toughness, affecting the very properties we have come to expect of titanium.

Osprey® Ti-6Al-4V-ELI (Grade 23) is manufactured using Electrode Inert Gas Atomization, resulting in highly spherical powder, extra low interstitials, good flow characteristics and high packing density.

Titanium properties start with the powder itself.
See the full material data: https://go.sandvik/2ct

Why do conventional hot-work tool steels often present challenges in additive manufacturing?

Osprey® HWTS 50 was developed with those challenges in mind, improving processability in Laser Powder Bed Fusion and reducing susceptibility to cold cracking – while maintaining the properties required for demanding hot-work applications.

Read the full article: https://go.sandvik/2bz

We’re at IMS 2026 in Boston and have enjoyed meeting customers, partners, and new connections this week.

If you’re attending over the next two days, let’s connect and discuss how Osprey® CE alloys can help address CTE mismatch and thermal reliability challenges.

You’ll find us at booth 14098.

We are pleased to introduce Osprey® GRCop-42 – a copper alloy powder developed for additive manufacturing of components operating under extreme thermal and mechanical loads.

Originally designed by NASA, GRCop-42 is one of the most demanding copper alloys to produce to specification, requiring tight control of composition and impurity levels.

At Sandvik, we have established controlled and repeatable production through our Vacuum Inert Gas Atomization (VIGA) process. Produced within an AS9100-certified quality system, Osprey® GRCop-42 is supported by full cradle-to-gate traceability – covering every step from raw materials to final batch testing.

The result is predictable performance and audit-ready documentation, supporting qualification and production in critical, high-performance applications.

Osprey® GRCop-42 is now available for both qualification and serial production.

Read the full press release: https://go.sandvik/2a8

Space Tech Expo USA is just around the corner.

We’ll be there to showcase Osprey® CE alloys and discuss how they fit your material and design requirements.

From high modulus and low density to tailored thermal expansion, our CE alloys are designed for applications where precision and stability matter.

If you’d like to learn more about what that could mean for your next project, visit us at booth 637.

We’re heading to OMTEC 2026.

If you’re attending, visit booth 1149 to talk about metal powder with our team. We’ll be there to discuss Osprey® titanium, cobalt chrome, and 17-4PH, along with other alloys in our portfolio.

If you’re curious about how we can support your material needs, make sure to stop by.