AUROTECH CORPORATION

May this year bring prosperity to your plans and peace to your days. Cheers to new chapters! Happy New Year- from Aurotech!

Let us celebrate the life of a hero who taught us the power of education, compassion, and nationalism.

By employing new technologies, the blade strength is improved compared to ZH05 blades. The ZHRF series minimizes blades slant cutting and achieves stable processing results even under high load conditions such as high speed processing, thick wafer cutting, or when cutting wafers with a large amount of metal on the streets

May this Christmas season bring hope, harmony, and fresh inspiration for the year ahead!

Due to optimizations in the unit design, changes in temperature when changing the flow rate of dicing water can be kept under 1ºC. Changes in dicing saws, grinder spindles, chuck tables, and workpiece areas around the process point due to changes in temperature can be minimized to help improve processing precision.

Powered by diamond bit technology, it ensures ultra-smooth planarization of metals, resins, and composites reducing bump height variation and surface roughness with exceptional accuracy.

With optimized structure and reduced energy use, it lowers operating costs while supporting efficient process monitoring and maintenance.

Engineered for precision and consistency, it's ideal for high-quality wafer surface polishing in advanced semiconductor processes.

This bond series employs a vitrified bond that has been difficult to manufacture into thin blades so far. These blades can process with an acute degree of straightness and dimensional accuracy for high-load processing by using the excellent rigidity and cutting ability of the vitrified bond.

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Featuring a 16% reduced footprint and front-access maintenance, it’s the ideal solution for efficient, high-density installations.

DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide.
Equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.

Maximize post-dicing efficiency with the DCS1440 cleaning system.
Designed for precision and flexibility, it offers customizable cleaning sequences and dual-nozzle options for thorough, high-performance workpiece cleaning.