Leaff Engineering

Leaff Engineering

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Leaff is an Italian company dealing with DSP and ICT

25/07/2025

DAFx25 – Ancona, 2-5 Sept 2025
Leaff has joined as a Silver Sponsor for the upcoming 28th International Conference on Digital Audio Effects (DAFx25) to be held in Ancona, Italy, organized by A3Lab (Department of Information Engineering, Università Politecnica delle Marche)!

We are glad to support DAFx25 (https://dafx25.dii.univpm.it/) and participate in the event at the fascinating historical monument, the Mole Vanvitelliana, in the port of our city, Ancona!

🔗 Register now: https://lnkd.in/dX9F9nyU

📅 Save the date: Sep 2-5, 2025

30/06/2023

Another round of our SAM V2 - DM56 audio matrix undertaking 48 hrs burn-in test.
To possibly land in the middle region of the bathtub curve!

30/05/2023

DSP modules in the lab ready for testing...a continuous learning process...

27/10/2022

Third in the series, two MERUS chips on a single module: same footprint, double the power and more flexibility in terms of audio channel configurations.
A small demo board is available to test the module performances for up to 4 analog balanced inputs and 4 amp outputs.
A Bluetooth® 5.0 interface is also available supporting 24-bit/96kHz high-resolution formats for high-fidelity wireless audio.

Photos from Leaff Engineering's post 14/10/2022

Developed in collaboration with VideoWorks team, SAM V2 audio matrix has been presented at Monaco Yacht Show 2022.
Processing capabilities have been dramatically improved thanks to a 1Ghz SHARC+ DSP available on our new SODIMM module LE-21569-SD.

The SAM V2 features 32 channels of Dante I/O, 4 SPDIF, 16 balanced I/O and 16x Powersoft amplified outs.
Analog stages have been designed using best in class components like ESS Sabre ADCs and DACs.

BeindSP software provides full control of SAM V2 during any step of configuration, setup and final audio tuning: thanks to our Digital Room Correction algorithm "PERCEPT", any pre-defined audio zone can be individually equalized following a fast and automatic procedure.
A consolidated 3rd party library let the system integrator control SAM V2 functionalities by his own mobile app.

06/05/2022

Stiamo cercando nuove figure da inserire nel nostro organico!
Invio CV: [email protected]

**Profilo: Embedded Linux Developer**
Laurea in area tecnico/scientifica (preferibilmente laurea in Ingegneria Elettronica, Informatica o laurea in scienza dell’informazione) o diploma tecnico (preferibilmente in Elettronica o in Informatica & Telecomunicazioni)

Competenze tecniche:
-Conoscenza Linguaggi C\C++;
-Esperienza di sviluppo SW\FW su sistemi embedded con RTOS e bare-metal;
-Esperienza su piattaforma ARM e su microcontrollori 32-bit;
-Conoscenza dei principali protocolli di comunicazione: SPI, RS232/RS485, USB, CAN, I2C, BT;
-Conoscenza tool di versioning: svn, git;
-Conoscenza Linux YOCTO;
-Conoscenza Qt;
-Conoscenza protocollo BT;
-Conoscenza dei principali protocolli di networking: Wi-Fi, Ethernet, DHCP, DNS;
-Gradita conoscenza di freeRTOS.


**Profilo: Junior Hardware Design Engineer**
Laurea in area tecnico/scientifica (preferibilmente laurea in Ingegneria Elettronica, Informatica o laurea in scienza dell’informazione) o diploma tecnico (preferibilmente in Elettronica o in Informatica & Telecomunicazioni)

Competenze tecniche:
-Esperienza di almeno 2/3 anni nell'ambito della progettazione di schede elettroniche basate su microcontrollore
-Completa autonomia nelle diverse fasi di progettazione di schede elettroniche (progettazione schema elettrico, progettazione layout, realizzazione distinta base)
-Conoscenza CAD elettronico (Altium)
-Conoscenza base delle tecniche di programmazione software/firmware
-Dimestichezza con strumenti di laboratorio
-Passione per l'elettronica e l’audio

19/11/2021

We are very proud to be collaborating with whole HEDD team to the development of their visionary products. It was really inspiring to see Klaus Heinz's genius at work.

09/09/2021

NU-Core 21569: our latest module, featuring 1 GHz SHARC processor, is specifically targeted to low-latency real-time audio applications. When used for fast prototyping of new products, allows for starting application development at the very early stage of the project. It is also a perfect match in production for modular architectures benefiting from scalable DSP power.
Compatible with Leaff's "beindSP" framework for real-time monitoring, tuning and control of networked devices.

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Indirizzo


Via Luigi Albertini 36/Blocco D5
Ancona
60131