EEE Project Components Supplier

EEE Projects & Components of EEE department

16/06/2025

এক বোর্ডের মধ্যেই ব্লুটুথ, ওয়াইফাই, মটর ড্রাইভার।
আপনার প্রজেক্ট কে সহজ করতে আজই যোগাযোগ করুন
Processors
– CPU: Xtensa Dual-Core 32-bit LX6 Microprocessor operating at 240 MHz and performing at up to 600 DMIPS.
– Ultra-Low Power (ULP) Co-Processor.

Memory
– 520KB of RAM (expendable to 8MB externally)
– 1024 locations for EEPROM
– 4MB of flash memory (expandable to 16 MB externally)

Capacitive Sensing GPIOs
– 1 × SPI
– 1 × I2S Interfaces
– 1 × I2C Interfaces
– 2 × UART
– All digital pins are compatible with an external interrupt

Wireless connectivity
– Wi-Fi: 802.11 b/g/n
– v4.2 BR/EDR and Bluetooth LE

Peripheral Interfaces
– 12-bit SAR ADC up to 18 channels
– 2 × 8-bit DACs (GPIO 25 and 26)
– 18 × PWM pins (Controlled by up to 16 channels)
– 7 × Touch Sensors