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Kemet Advantage Inventory MLCC Ceramic Capacitor
C0603C101J2GACTU 4K/R KEMET 22+ 0.0038USD SMD
C1206C102J1GAC 4K/R KEMET 22+ 0.012USD SMD
C1206C473KCRAC7800 2K/R KEMET 21+ 0.021USD SMD
C1210C476M9PACTU 1k/R KEMET 22+ 0.067USD SMD
C0603C103J3GACTU 4K/R KEMET 22+ .0163USD SMD
C2220C105K5RACTU 1K/R KEMET 22+ 0.23USD SMD

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Yageo CL series MLCC Capacitor effectively reduces ESL

Yageo, a global leader electronic components supplier, has launched the CL series of MLCC Capacitor for applications requiring low ESL (equivalent series inductance). Yageo's CL series MLCC Capacitor portfolio covers X5R (sizes from 0204 to 0612) and X7R (sizes from 0306 to 0612), with a capacitance value up to 1uF and a rated voltage of 50V.

When MLCC Capacitor are used as decoupling/bypass capacitors around ICs on power lines, as the operating speed and frequency of ICs increase, the parasitic ESL of general-purpose MLCCs will reduce the discharge current at high frequencies, causing noise and noise. voltage fluctuations. In order to stabilize the operation of power, it is necessary to configure more general-purpose MLCCs, or use a better way to apply to MLCCs with low ESL.

YAGEO low ESL MLCC Capacitor - CL series, is a reverse termination type, the terminal electrode is arranged on the long side, which makes the current path smaller, which can effectively reduce the ESL by 50% ~ 80%, the actual value depends on the component type. Therefore, the high-frequency (>100MHz) electromagnetic interference generated by ordinary MLCCs can be well suppressed.

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1. Good price with shortest lead time.

2. 400-Days Warranty for all parts.

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4. Sourcing obsolete electronic components.

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In order to improve the efficiency and power density of converters and inverters in circuit boards, manufacturers are experimenting with third semiconductors, such as semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC), to create metal oxide semiconductor fields Effect transistors (MOSFETs) and other electronic components.

Compared to traditional silicon-based materials, these materials can operate at higher switching frequencies, resulting in higher current and power generation; at the same time, they have higher temperature ratings, so they are suitable for automotive electronics, aerospace, Harsher application environments such as energy production and test equipment.

However, advances in semiconductor technology can have a knock-on effect, affecting critical components in DC bus applications and other power circuit applications. Fast switching of circuits in a small package means that the associated components enter a super high temperature state, which requires passive components in the application (such as DC bus capacitors and snubber capacitors) to operate at temperatures as high as 125°C, Otherwise, engineers will have to design supplemental cooling systems, which will ultimately increase the weight, complexity and cost of the power module.

The industry's past application practice for this has been to use large film capacitors with high current ratings and high reliability, however since they melt at high temperatures. At the same time, traditional MLCC ceramic capacitors, such as Class II X7R capacitors, although they can operate at high temperatures, they can achieve less than ideal capacitance values at high voltages. Then there is a need for alternatives that can meet the high-voltage and high-temperature resistance requirements of the power electronics industry for components.

How are their characteristics compared to conventional capacitors?

In recent years, component manufacturers have introduced two new capacitor technologies, lead lanthanum zirconate titanate (PLZT) and strontium bismuth titanate (SBFT) dielectrics, designed to meet the high voltage and high temperature requirements of the power electronics industry. Reaching this level requires engineers to have an in-depth understanding of the DC bias and AC current versus capacitance and capacitance of bismuth strontium titanate (SBFT), lead lanthanum zirconate titanate (PLZT), and multilayer ceramic capacitors (MLCCs) based on traditional X7R materials. Performance analysis of temperature rise effects.

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Multilayer Ceramic Capacitor,Electrolytic Capacitor,Chip Resistor - Surface Mount Supplier | TOP Source Electronics TOP Source Electronics Ltd. is a supplier of electronic components such as Multilayer Ceramic Capacitor MLCC, Aluminum Electrolytic Capacitor, Chip Resistor - Surface Mount.

Chip price reduction does not mean new energy vehicle price reduction
Recently, according to CCTV financial reports, after experiencing the skyrocketing chip price, the chip market price has gradually fallen recently, and there have been price cuts.
According to Bloomberg, the vast majority of chip companies currently believe that there will be a major turning point in this hot market for a long time to come, and some even pessimistically believe that the semiconductor industry will usher in the worst decline in a decade. Especially in the memory industry, prices have been falling all the way recently, and there is still no sign of easing.
New energy vehicles continue to rise in price
The price increase of new energy vehicles is not entirely due to the chip problem, so the price reduction of chips will not lead to a large-scale price reduction of new energy vehicles, and the recent increase in the price of new energy vehicles because of "raw material prices"? The price has also gone up!
Since 2021, due to a combination of factors such as rising raw material prices and chip shortages, the production cost of new energy vehicles has increased. The "butterfly effect" of car companies' price increases has become more and more intense due to the rising raw material prices. At least 30 mainstream car companies, including Tesla, SAIC-GM-Wuling, and Geometry, have successively adjusted the prices of their new energy models in the past two years.
From March 10th to 17th, 2022, Tesla raised the prices of the two hot-selling models Model 3 and Model Y three times in a week. Among them, the Model 3 high-performance models were released on March 10th and March 15th The daily price increase is 10,000 yuan and 18,000 yuan, and the cumulative increase is 28,000 yuan.
So this is the situation: although the prices of some chips have fallen, but the decline is not large, the prices of chips are still relatively stable, coupled with the strong momentum of new energy vehicles in the past two years, the demand is soaring, car companies will not The short-term price drop of chips will lower the price of new energy vehicles. After all, the price of new energy vehicles is affected by the price of raw materials, as well as the relationship between supply and demand in the end market.
At present, chips with relatively large price drops are mainly concentrated in the field of consumer electronics, while automotive chips are still in short supply, supply inventories are still at historically low levels, and corresponding prices will remain high.
Whether the price of new energy vehicles rises or falls is mainly determined by the current supply and demand in the new energy vehicle market.
Has the chip really dropped in price?
Intel has notified customers that it will increase the price of semiconductor products in the second half of 2022. It is expected to increase the price of a wide range of products such as core servers and computer CPU processors and peripheral chips. The biggest gain could be 10% to 20%.
This shows that the price of consumer electronics chips is only reduced, and the demand for other chips such as MCU and automotive chips is still strong.
An average car needs to use 500 chips, and new energy vehicles carry more chips. Last year, the global car sales were about 81.05 million, which means that the entire automobile industry chain needs 40.5 billion chips.

Learn more about electronic components industry news：
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New | Murata commercializes chip ferrite beads with a rated current of 20A

Murata Manufacturing Co., Ltd. has commercialized the chip ferrite beads "BLE32SN series" and started mass production in August 2022. This product achieves an ultra-high rated current of 20A in chip noise suppression components.

With the electrification of vehicles such as electric vehicles (EVs) and hybrid electric vehicles (HEVs), new electric drive circuits such as DC-DC converters and ONBOARD CHARGER (OBC, on-board chargers) have been put into use. Since large currents flow in these circuits, noise suppression components with large current characteristics are required.

In addition, in the field of industrial equipment, as the power consumption increases due to the improvement of functions, noise suppression components that can withstand large currents are also required. There were no chip-type noise suppression components that could withstand large currents, so it was only possible to withstand large currents by using large components or multiple components.
Therefore, Murata has developed and commercialized Murata's first chip-type noise suppression element with a rated current of 20A through unique internal electrode and material/structural design optimization. This product is 3225 size (3.2 x 2.5 x 2.0 mm), which is small in size but can withstand high current, so it can make the whole system smaller and lighter by reducing the installation space and the number of components used.

Main expertise

Withstand high current:
Murata's first chip noise suppression device capable of withstanding a rated current of 20A. Successfully reduced noise for power conversion circuits and power supply circuits using large currents.

Low DC resistance:
The low DC resistance value suppresses heat generation and reduces power consumption.

Stable squelch effect:
Stable noise suppression effect even when a large current flows

The main purpose

Vehicle use:
Power circuits for electric vehicles and hybrid vehicles, such as: ONBOARD CHARGER (OBC); BATTERY MANAGEMENT SYSTEM (BMS, battery management system); POWER CONTROL UNIT (ie PCU, which converts the voltage appropriately and drives the motor and electrical components devices that supply power stably), etc.

Industrial applications:
Power circuits for industrial equipment, etc. used in factories.

Learn more about electronic components industry news：
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Chiplet is thoroughly active! How will chip design change?
Last weekend, the semiconductor sector, which had been silent for half a year, set off a daily limit wave driven by the concept of Chiplet. It can be said that Chiplet technology is the hottest topic in the current semiconductor field. The chiplet concept is completely on fire!

What is a Chiplet?
In recent years, with the failure of Moore's Law, the industry has begun to explore and deploy products from Chiplet technology, Chiplet standards, and Chiplet-related technologies. Especially after entering 2022, there will be more and more industry dynamics related to Chiplet. Chip giants such as Intel, AMD, ARM, TSMC, and Samsung launched a new interconnection standard UCIe aimed at Chiplet; Apple released a top-level computer chip M1 Ultra that belongs to the category of Chiplet technology; Huawei released a patent for 3D stacking technology... Chiplet is considered to be one of the important technologies that will continue to increase the scale and density of chips in the post-Moore era.

Chiplet is commonly known as core particle, also known as small chip technology. Chiplet technology is like building blocks. Some pre-produced Dies (bare chips) with different functions, architecture systems, processes and materials are packaged together through advanced integration technology to form a system-on-chip. And these basic Dies are Chiplets.

Since Chiplet's smaller silicon area is less prone to manufacturing defects, it can greatly improve yields for larger chips. In addition, Chiplet can also reduce the complexity and design cost of the design, and reduce the cost of chip manufacturing.
However, although the major chip leaders have joined Chiplet technology one after another, based on their own resources and strength and the position of the industry chain, the position of developing Chiplet technology is naturally inconsistent.
So, is Chiplet a "wind vent" or a "gust of wind"? Will Chiplet be the technology path to solve the limited development of advanced technology? What is the cost advantage of Chiplet integrated chips compared to single chips? Will the cost be lower? How will chip design change?
Learn more about electronic components industry news：
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